Co-planarity of IC-pins

The term „co-planarity“ discribes the proper seating of the tips of fine-pitch device leads on the copper pads on a PCB prior to solder process. The coplanarity is a critical dimension for the quality of the soldered joints, because no reliable and correct soldering can be done if there is a gap between the lead and the pad. In state of the art automatic assembly machines the co-planarity of components is measured during the assembling process. The component to be measured is passed over a triangulation displacement sensor which has a laser beam that scans the row of pins.

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Application "Co-planarity of IC pins" (PDF, 104 KB)

Sensorica-M, Ltd.
443030 Samara
ul. Mechnikova 1, of.203
+7 / 846 / 24 65 213
+7 / 846 / 33 45 517