Measurement tasks in the semiconductor industry require highest accuracy and repeatability. Micro-Epsilon offers the right solution for numerous applications from precise machine positioning and wafer inspection to topographic measurements.
High precision thickness measurement of silicon wafers
Capacitive displacement sensors are used for the exact thickness measurement of wafers. Two opposing sensors detect the thickness and also determine other parameters such as deflection or sawing marks. ...Показать детали
Recognition and measurement of bumps on silicon wafers
Confocal chromatic displacement sensors from Micro-Epsilon are used to inspect bumps. They generate a small light spot onto the wafer, while reliably detecting the smallest of parts and structures at high ...Показать детали
Positioning of the lens system in lithography machines
Non-contact, inductive displacement sensors (eddy current) measure the position of lens elements in order to achieve the highest possible imaging accuracy. Depending on the lens system, displacement sensors ...Показать детали