Semiconductors & Wafer

Measurement tasks in the semiconductor industry require highest accuracy and repeatability. Micro-Epsilon offers the right solution for numerous applications from precise machine positioning and wafer inspection to topographic measurements.

Nanometer positioning in lithography machines

To illuminate individual components on the wafer, the lithographic devices move the wafer to the respective position. Capacitive displacement sensors measure the position of the travel path in order to ...

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Positioning the wafer stage using white light interferometers

The white light interferoMETER IMS5600 from Micro-Epsilon is used for position monitoring of the wafer stage. It measures the XYZ movements of the stage with extremely high accelerations. The high-precision ...

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Dimensional inspection of silicon ingots

Laser profile scanners from Micro-Epsilon are used to inspect the geometry of silicon ingots. These detect the complete geometry of the silicon rods. This allows geometrical deviations of the silicon block ...

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Bow and warp of wafers

Confocal chromatic sensors scan the wafer surface to detect bow, warp and distortion. Providing a measuring rate of 70 kHz, confocalDT controllers enable highly dynamic measurements, allowing the wafer ...

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3D shape measurement of wafers

reflectCONTROL deflectometry systems are used to detect the flatness or planarity of 150 mm wafers. These measure the flatness with only one image. For this purpose, the sensors project a striped ...

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Recognition and measurement of bumps on silicon wafers

Confocal chromatic displacement sensors from Micro-Epsilon are used to inspect bumps. They generate a small light spot onto the wafer, while reliably detecting the smallest of parts and structures at high ...

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Determining the position during wafer handling

When handling wafers, exact and repeatable positioning is crucial. During the infeed of wafers, two optoCONTROL laser micrometers inspect the diameter and thus determine the horizontal position. Thanks ...

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Positioning of masks in lithography

Lithography processes require high resolution and long-term measurement of machine movements in order to achieve maximum precision. High resolutions enable nanometer-precise positioning of masks using ...

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Detection and measurement of saw marks

For automatic detection and measurement of saw marks, confocal chromatic sensors from Micro-Epsilon are used. The fast surface compensation feature of the controller regulates the exposure cycles in order ...

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Transparent layers & adhesive beading

Confocal chromatic sensors are used for one-sided layer thickness measurements. The confocal measuring principle enables the evaluation of several signal peaks, allowing the thickness of transparent materials ...

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Positioning the wafer stage using capacitive sensors

Capacitive displacement sensors are used for fine positioning tasks in the wafer stage. These sensors measure the position of the stage at various points, which is particularly useful for fine alignment. ...

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Positioning of the lens system in lithography machines

Non-contact, inductive displacement sensors (eddy current) measure the position of lens elements in order to achieve the highest possible imaging accuracy. Depending on the lens system, displacement sensors ...

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Positioning the wafer stage

Non-contact sensors from Micro-Epsilon are used for position monitoring of the wafer stage, where they measure highly dynamic XYZ movements of the stage which accelerates very rapidly. Capacitive and inductive ...

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Inspection of cracks and breakages

Confocal chromatic sensors from Micro-Epsilon are used to detect cracks and other defects on the wafer. They reliably detect surfaces with varying reflection characteristics due to a fast surface compensation ...

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Monitoring the alignment of lenses using confocal chromatic sensors

Confocal chromatic sensors are used to measure the alignment of the lens. Several sensors measure directly on the lens to detect the tilt angle to nanometer accuracy. Unlike electromagnetic sensors, confocal ...

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Inspection of the orientation notches on silicon ingots

Ingots are often provided with orientation notches, which are necessary for the alignment of the ingots. Blue laser scanners from Micro-Epsilon are used to inspect the profile of the notches for dimensional ...

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Tilt angle measurement of wafers

The exact position of the wafer plays an important role in wafer handling. During the infeed of wafers, white light interferometers measure the horizontal tilt angle of wafers. Two interferometers ...

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Monitoring the axial movement of internal hole saws

Internal hole saws are used for cutting silicon ingots. In order to achieve reliable separation of the ingot, the saw blade or holder is monitored using eddy current sensors. Four sensors measure the distance ...

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Monitoring the deflection of wire saws

Wire saws are used to cut ingots in only one step. Since the wire is subject to strong wear, the wire bed is monitored at several points using non-contact eddy current sensors. These not only detect the ...

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Monitoring optical systems using wavefront sensors

Shack-Hartmann wavefront sensors from Optocraft measure the alignment state and the imaging quality of the entire optical system. The robust measuring principle allows machine integration and automated ...

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Wafer thickness measurement / TTV

Confocal chromatic sensors measure the thickness deviation (Total Thickness Variation) and the wafer thickness from both sides. Based on the wafer thickness profile, bow and warp of the wafer can be detected. ...

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High precision thickness measurement of silicon wafers

Capacitive displacement sensors are used for the exact thickness measurement of wafers. Two opposing sensors detect the thickness and also determine other parameters such as deflection or sawing marks. ...

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Sensorica-M, Ltd.
443030 Samara
ul. Mechnikova 1, of.203
info@sensorica-m.ru
+7 / 846 / 24 65 213
+7 / 846 / 33 45 517