High precision thickness measurement of silicon wafers

Capacitive displacement sensors are used for the exact thickness measurement of wafers. Two opposing sensors detect the thickness and also determine other parameters such as deflection or sawing marks. The position of the wafer in the measuring gap may vary.

Sensorica-M, Ltd.
443030 Samara
ul. Mechnikova 1, of.203
info@sensorica-m.ru
+7 / 846 / 24 65 213
+7 / 846 / 33 45 517