Recognition and measurement of bumps on silicon wafers

Confocal chromatic displacement sensors from Micro-Epsilon are used to inspect bumps. They generate a small light spot onto the wafer, while reliably detecting the smallest of parts and structures at high resolutions. Therefore, shape and dimensions of bumps are reliably measured for contacting purposes.

Sensorica-M, Ltd.
443030 Samara
ul. Mechnikova 1, of.203
info@sensorica-m.ru
+7 / 846 / 24 65 213
+7 / 846 / 33 45 517