Wafer thickness measurement / TTV

Confocal chromatic sensors measure the thickness deviation (Total Thickness Variation) and the wafer thickness from both sides. Based on the wafer thickness profile, bow and warp of the wafer can be detected. High measuring rates enable thickness detection of the entire wafer in short cycle times.

Sensorica-M, Ltd.
443030 Samara
ul. Mechnikova 1, of.203
info@sensorica-m.ru
+7 / 846 / 24 65 213
+7 / 846 / 33 45 517